The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).

A recent review article published in Advanced Materials explored the potential of artificial intelligence (AI) and machine learning (ML) in transforming thermoelectric (TE) materials design. The ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

Atomic-scale defects in crystals can make excellent quantum memories that can be written and read out using lasers, and could form the basis of future quantum communications and computing systems.

Each hose undergoes repeated pressure cycle testing and temperature stress evaluation to guarantee consistent braking performance, even under prolonged heavy-duty operation. This approach addresses ...

Tungsten carbide–cobalt (WC–Co) is prized for its hardness, but that same property makes it unusually difficult to shape. The current process is ...