HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

This is the world’s first AI-powered super agent from Cadence that autonomously creates and verifies designs from specifications and high-level descriptions ...

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced the release of an artificial intelligence “Super Agent” designed to transform front-end silicon ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. Electronic Design Automation leader, Cadence Design Systems is ...