In advanced semiconductor manufacturing, inspection and FA are not overhead—they are economic control mechanisms that protect ...

A research team led by Dr. Jeong Min Park of the Nano Materials Research Division at the Korea Institute of Materials Science ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

MILPITAS, Calif., July 10, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring ...

Understanding your company’s manufacturing process and how to minimize defects has always been important. Today, its importance is increasing with the complexity of products and the customers' demand ...