High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

For 2.5D packaging, achieving high bandwidth relies on the redistribution layer (RDL) within the package, where features like Line/Space (L/S), via, and pad dimensions are important. However, ...

The MarketWatch News Department was not involved in the creation of this content. BOSTON, July 24, 2024 /PRNewswire/ -- Over the past decade, the capacity of data center Ethernet switches has surged ...

BOSTON--(BUSINESS WIRE)--Advanced microelectronics are moving on from the Moore’s Law era to be “more-than-Moore”. Denser chips have higher internal and external clock rates, and higher power ...

Analysis by IDTechEx says technological refinement and commercial scaling are among the challenges still being confronted in the chemical recycling subsector. Polypropylene is among the resin types ...