The automatic detection of surface-level irregularities—defects or anomalies—in 3D data is of significant interest for various real-world purposes, such as industrial quality inspection, ...

Emergence of anti-hyperuniform defect organization in active nematics. At high activity (left), topological defects are distributed nearly uniformly throughout the system. Reducing activity toward a ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...