SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

SCHMID Group secures Major Orders for AI Server PCB Production Equipment Freudenstadt, In one project, SCHMID will deliver a complete wet-process equipment setup featuring its advanced V+ and H+ ...