As a seasoned tester, the responsibilities in defect management extend beyond the routine tasks of reporting issues and verifying resolutions. While these ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Physical defects like shorts and opens may occur during any step of the fabrication process. Well-known fault models like stuck-at (SA), 1 transition (TR), 2 N-detect (ND), 3 gate-exhaustive (GE), 4 ...

Synopsys announced links between its TetraMAX ATPG tool and Odyssey yield-management system, touted a collaborative effort with Virage Logic, and said it's working with several customers on ...