Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...

Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...

A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...

Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.

A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...

Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...

Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design.” Abstract “While Large Language Models (LLMs) show ...

A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...

New joint venture for high-speed interconnects; 2nm Indian chips; NAND capacity boost; quantum accelerates; CPO deals; U.S. rare earths deal; new AI chip; earnings bonanza; new test/package plant; ...

Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...

Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory ...