Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

The Trump administration and a bipartisan group of 13 governors announced an agreement urging the PJM Interconnection — the largest electric grid operator in the U.S. — to “…expand the energy supply, ...

Abstract: To address the growing demand for intelligent manufacturing in personalized, large-scale, and multivariety production, multirobot systems have demonstrated significant potential, as they can ...